Handheld electronic device main board

Handheld electronic device main board

Expired Date

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Mar 15 2019

Minimum Order Quantity

-

0 Pieces

Delivery Time

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1-10 days

Packaging Details

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carton

Payment Methods

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T/T

Sell Offer Description

Product name: Handheld electronic device main board
low cost pcb fabrication
Characteristic
1. the blind buried structure is complex. first order HDI:
Blind L1-L2. L5-L6
Buried L2-L5
Through hole L1-L8
2. multiple pressure. heavy copper;
3. laser drilling blind holes;
4. the line width is small. and the etching is difficult;
5. pressing. line. drilling accuracy requirements;
6. a number of times to reduce the surface of copper.

manufacturing pcb china
Specifications
Layer count: 6
Board thickness: 1.0mm
Base materials: FR4 S1000-2
Finished size: 212 170mm
Surface finish: Immersion+OSP
Line width/line space: 3/3mil
Minimum hole: 0.10mm
Solder resist color: Light blue
inner layer H OZ outer layer 1 OZ

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